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Benfer Multiplan 50-FI Single Part Levelling Compound

Code: PRODUCT-65

  • Fibre Reinforced, Suitable On Plywood Overlay

  • Suitable On Underfloor Heating

  • Fast Curing, Light Foot Traffic After 2-3 Hours*
    • Flexible, Polymer Modified

  • Easy To Mix, Can Be Pump Applied

  • For Layers 3-50mm Thick

  • For Interior Application Only

  • EN 13813 CT C30 – F7 A1 f

£16.66 exc. VAT £19.99 inc. VAT
Quantity:

Description

MULTIPLAN-50 FI is used for smoothing and levelling in layers of 3-50 mm thick. Suitable
substrates are concrete floors in accordance with DIN 1045, heated and unheated cement
based screeds and non in accordance with DIN 18560, old, well bonded tile finishes and
rapid cement based screeds. MULTIPLAN-50 FI is also suitable for use on plywood overlay, on
chipboard and on old wooden floorboards as well.
• On timber floor boards;
• On old substrates with bonded adhesive and levelling compound residues;
• For the restoration and repair of wooden floors and additionally for screeds and substrates in
old and new construction;
• For producing flat, absorbent, high strength installation surfaces for textile and elastic floor
finishes as well as for ceramic tiles;
• Suitable for use on heated substrates.

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